Optical interconnection technology is a key technology in fields such as broadband communication

supercomputing

and data centers

and is also widely used in the field of radar electronics. In order to meet the requirements of harsh environments such as wide temperature

anti vibration

and anti impact in the field of radar electronics

as well as the technical requirements of high integration

high frequency

and light weight

this article introduces a design concept of a miniaturized optical module based on a common board. This design integrates microelectronics technology and photon technology through integrated packaging technology to achieve the common board integration of electronic chips and optical chips. It not only leverages the advantages of fast optical interconnection speed

large bandwidth

anti-interference

high density

and low power consumption

but also fully utilizes the advantages of mature microelectronics technology

high-density integration

high yield

and low cost. At the same time

a simple analysis of the architecture design and key technologies is conducted

and finally

physical test results are provided. Prove that this optical module can further improve integration

reduce the volume of the optical module

reduce costs and power consumption

and can be applied to more optoelectronic interconnection systems.